Epoxy Prepregs

SE 70

  • Low temperature 70°C / 160°F curing.
  • Faster cycle times at elevated temperature
  • Excellent balance of mechanical properties and toughness
  • Excellent surface finish
  • Long out-life - up to 4 weeks at 18-22°C / 65-72°F
  • Range of compatible adhesive films and ancillary products
  • Suitable for vacuum bag, press or autoclave consolidation

Gurit’s SE 70 is a hot melt, low temperature cure, epoxy prepreg system. It has been developed for use in the construction of large components using low energy cure cycles. Excellent properties can be achieved with a processing temperature of just 70°C / 160°F. From this cure temperature the system exhibits very good mechanical properties and excellent toughness.

Cure temperature for a 16 hours cure cycle is 70°C / 160°F - this temperature allows less expensive tooling and ovens to be used, with lower thermal movement and distortion. Faster cures are available from higher cure temperatures. However, thicker sections (>10mm) will require the insertion of a suitable dwell into the cure cycle. Up to 20mm thick laminates may be moulded at 70°C / 160°F with a peak exotherm only slightly above the cure temperature.

Typical Applications

SE 70 is widely used in sandwich structures with honeycomb, foam and balsa cores, primarily with the toughened SA 70 Adhesive Film.

Essential Product

Readily available to purchase via Gurit's global distributor network click to find a distributor near you.

Technical Data

​Min Cure Temp/Time
Typical Laminate 8 plies of 200g/m2 HEC UD Carbon 37% resin content -
Typical Ramp Time 1–2°C (2–4°F) per minute -
Cure Temperature 70°C (158°F) 80°C (176°F) 95°C (203°F) 110°C (230°F) -
Cure Dwell Time 16 hours 8 hours 4 hours 50 minutes -
Cure Pressure -1bar (14.5Psi) -
De-mould Temperature < 60°C (140°F) -
Dry Tg1 (DMA) 89°C / 192°F 101°C / 214°F 110°C / 230°F 126°C / 259°F ISO 6721 (DMA)
​​Cured Resin Prop.
Tensile Strength 54 MPa 7.83 Ksi ISO 527-2
Tensile Modulus 3.61 GPa 0.52 Msi ISO 527-2
Flexural Strength 80 MPa 11.6 Ksi ISO 178
Flexural Modulus 3.45 GPa 0.50 Msi ISO 178
Compressive Strength 142 MPa 20.6 Ksi ISO 604
Compressive Modulus 3.81 GPa 0.55 Msi ISO 604
​UD Lam Prop.
Resin Content 37%
Cure Method Vacuum bag cured at -1 bar
Cure Schedule 16 hours at 70°C (158°F)
Cured Ply Density 1.49g/cm3 0.054 lb/in3
Glass Transition Temperature 89°C 192°F
Cured Ply Thickness 0.20mm 0.008in
0° Tensile Cured Fibre Volume 54.7%
0° Tensile Strength 2524 MPa 366 Ksi
0° Tensile Modulus 137 GPa 19.9 Msi
0° Compressive Str. Fibre Volume 55.2%
0° Compressive Strength 1490 MPa 216 Ksi
0° Compressive Mod. Fibre Volume 56.0%
0° Compressive Modulus 126 GPa 18.3 Msi
90° Tensile Cured Fibre Volume 54.0%
90° Tensile Strength 42 MPa 6.1 Ksi
90° Tensile Modulus 7.81 GPa 1.13 Msi
0° Flexural Fibre Volume 55.9%
0° Flexural Strength 1406 MPa 204 Ksi
0° Flexural Modulus 99 GPa 14.4 Msi
0° ILSS Fibre Volume 50.8%
0° ILSS 86 MPa 12.5 Ksi
​Third Party Certs.
Germanischer Lloyd WP 1330031 HH
​Ancillary Prod.
SF 70 SPRINT™ Toughened Surfacing Film
SA 70 Epoxy Adhesive Film
SP 11100 Monocomponent Paste