Prepregs

Low Temperature Curing Prepreg & SPRINT™ Materials

Gurit’s range of low temperature curing prepregs have been developed to allow for the use of cost-effective tooling solutions in the construction of large components.

Product Selector

Format

System

Main Features

Fastest Cure

Recommended Processing Method

Max Tg1

Typical Applications

Prepreg

SE 70

  • Curable at 70°C in thick sections
  • Available in SPRINT™ and prepreg formats
  • Range of compatible 70°C curing products

25 mins at 120°C

  • Autoclave
  • Press Moulding
  • Vacuum Bagging

126°C

Sandwich structures with honeycomb, foam and balsa cores

SPRINT™

ST 70

SE 70

SE 70 is a family of hot melt, low temperature (70ºC) cure, epoxy prepreg systems. They have been developed for use in the construction of large components using low energy cure cycles, and have an outlife of 28 days at 21°C. Excellent properties can be achieved at this cure temperature, particularly compressive and interlaminar shear strengths.

ST 70

This is a low temperature (70ºC) cure, SPRINT™ system. Developed for use in the construction of large components using low energy cure cycles, it has an outlife of 21 days at 21°C. Excellent properties can be achieved at this cure temperature, particularly compressive and interlaminar shear strengths.

For further information, please see the related documents on the side bar or contact your customer support representative.