Adhesive Films from SP-High Modulus
SP-High Modulus adhesive films are designed for secondary bonding, core-bonding and for co-curing with the range of SP-High Modulus prepregs and SPRINT®. They are toughened for impact resistance and peel strength, and are subject to controlled flow for maximum bond integrity.
The adhesive films are available at various weights, with or without a carrier, and are divided into SA70 films, (for use with the SE70 range of prepregs) and SA80 films, (for use with the SE84 range of prepregs), and can be supplied pre-coated on to SP-High Modulus prepregs.
SA 70 – Epoxy Adhesive System
- Low temperature cure
- Designed for bonding prepreg skins to honeycomb and certain foam cores
- Compatible with SE 70 prepregs
- Toughened for impact resistance and peel strength
- Controlled flow for maximum bond integrity
SA 80 – Toughened Low Energy Cure Epoxy Adhesive Film
- Low temperature cure
- Designed for bonding prepreg skins to honeycomb and certain foam cores
- Compatible with SE 84 & SE 85 prepregs and SPRINT® products
- Toughened for impact resistance and peel strength
- Controlled flow for maximum bond integrity