Ancillary Equipment from SP-High Modulus

SOLVENTS
A range of solvents for cleaning tools and surfaces and solvents for the thinning of SP-High Modulus solvent-based resin systems. Due to the very different chemistry of some of the SP-High Modulus products from each other, it is important that the correct solvents are selected for the intended application.
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FILLER POWDERS
SP-High Modulus filler powders are designed to modify the properties of some of the SP-High Modulus liquid solvent-free epoxy resins and so to create a variety of semi-liquid products such as filling and fairing compounds and adhesives. The fillers form three distinct categories: hollow spheres, short fibres, and flow modifiers.
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SUNDRIES
The following application and sundry items are designed to assist the user in dispensing, mixing and applying SP-High Modulus formulated products, quickly, efficiently and safely and are divided into three product groups,  Mixing & Dispensing, Application, Skin Protection and Pigmenting
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