Solvents from SP-High Modulus

SP-High Modulus produces a range of formulated solvents for use with both solvent-free and solvent-based products. Due to the very different chemistry of some of the SP-High Modulus products from each other, it is important that the correct solvents are selected for the intended application.

Cleaning Solvents from SP-High Modulus

SP-HIGH MODULUS FAST SOLVENT (Solvent A)
SP-High Modulus Fast Solvent is an extremely fast evaporating solvent which is recommended for cleaning all types of surfaces prior to applying a solvent-free products such as SP 320, SP 106, Handipack, Ampreg 22 and Ampreg 26, whether bonding, coating, filling or laminating. SP-High Modulus Fast Solvent will clean brushes and equipment if the epoxy is still in a liquid state, but if the epoxy has started to gel, it will no longer be effective. In this case, SP-High Modulus Standard Solvent (Solvent B) is superior.
               

SP-HIGH MODULUS STANDARD SOLVENT (Solvent B)
SP-High Modulus Standard Solvent is a slow evaporating solvent which is specifically designed for cleaning brushes and other equipment which has become contaminated with solvent-free epoxy products such as SP 320, SP 106, Handipack, Ampreg 22 and Ampreg 26. Under no circumstances should SP-High Modulus Standard Solvent be used for cleaning surfaces to be bonded or coated. SP-High Modulus Standard Solvent can dissolve partially gelled resin system, but cannot break down a fully cured epoxy.
                      

SP-HIGH MODULUS CLEANING FLUID (Solvent C)
SP-High Modulus Cleaning Fluid is designed specifically for use on the surface of cured epoxies to remove ‘by-product’. This is a ‘sticky’ or ‘greasy’ film which can develop particularly in cold curing conditions or in high humidity environments. SP-High Modulus Cleaning Fluid can be used with SP 106, Ampreg 22, Ampreg 26 or Handipack, but is not recommended for use with SP 320 epoxy.

Unlike other solvents such as SP-High Modulus Fast Solvent, SP-High Modulus Cleaning Fluid will not soften or attack plastic surfaces or those recently coated with epoxy. As a result, SP-High Modulus Cleaning Fluid is not effective as a brush cleaner or for removing semi-cured epoxy from brushes, surfaces or equipment. However, it may be used for cleaning individual resin or hardener components from plastic mini-pumps without causing damage to the plastic components. SP-High Modulus Cleaning Fluid is therefore ideal as a surface cleaner for all types of plastic surfaces, for cleaning glass and for general grime or dust removal.